Athlon 64
| Entwicklungsgeneration |
K8 |
|
|
| Kernproduktion |
FAB 30, Dresden, Deutschland |
| Test, Montage, Beschriftung |
Penang, Malaysia |
|
|
| Transistoren |
105,9 Millionen (Sledge-/Clawhammer) |
| Fertigungstechnik |
9 Lagen, CMOS (Complementary Metal-Oxide
Semiconductor), SOI (Silicon On Insulator), 6 Layer low-K Dielektrika,
Copper Interconnects |
|
|
|
|
| Level 1 Daten Cache |
64 KiB |
|
2-Way Associative |
|
8-Way Bank-Interleave |
|
2*64 Bit Zugriffe pro Takt, lesen oder
schreiben in verschiedenen Banken |
|
3 Takte Latenz |
|
ECC Cache Protection (8 KiB) |
|
40 TLB (Translation Look aside Buffers)
Einträge (32* 4k page translations, 8* 2/4 M page translations) |
|
|
| Level 1 Befehls Cache |
64 KiB |
|
2-Way Associative |
|
128 Bit Lese- und Schreib-Port |
|
Parity Protection (1 Bit pro 16 Bit) |
|
40 ITLB (Instruction Translation Look aside
Buffers) Einträge (32* 4k page translations, 8* 2/4 M page translations) |
|
|
| Level 2 Cache |
256/512/1024 KiB |
|
16-Way Associative |
|
Exclusive Architektur |
|
16 Takte Latenz (+ 3 Takte L1) |
|
ECC Cache Protection |
|
128 Bit Anbindung |
|
512 DTLB (Data Translation Look aside Buffers,
4-Way set-asociative virtual to physical address translation) |
|
512 ITLB (Instruction Translation Look aside
Buffers, 4-Way set-asociative virtual to physical address translation) |
|
|
|
|
| Integer Core |
12 stufige Pipeline |
|
3 ALU (Arithmetic Logic Unit) |
|
3 AGU (Address Generator Unit) |
|
64 Bit Integer Register |
|
48 Bit virtueller Adressraum, 40 Bit
physikalischer Adressraum |
|
16 General Purpose Register |
|
|
| Floating Point Core |
17 stufige Pipeline |
|
1*FMUL |
|
1*FADD |
|
1*FSTORE |
|
80 Bit Floating Point Register |
|
|
| Flags |
fpu vme de pse tsc msr pae mce cx8 apic sep
mtrr pge mca cmov pat nx pse36 clflush mmx fxsr sse sse2 syscall mmxext
lm 3dnowext 3dnow |
Athlon 64
(Die "Thermal Desing Power" Angaben beim P-Max Modus basieren teilweise auf Messwerte verschiedener Quellen, alle anderen Zahlen sind die theoretischen Maxima)
| Modellnummer |
3000+ |
3200+ |
3500+ |
|
|
|
|
| OPN |
ADA3000DIK4BI |
ADA3200DIK4BI |
ADA3500DIK4BI |
| Taktfrequenz (P-Max) |
1800 MHz |
2000 MHz |
2200 MHz |
| L2 Cache |
512 KiB |
512 KiB |
512 KiB |
| CPUID |
00010FF0h |
00010FF0h |
00010FC0h |
|
|
|
|
| Kernspannung |
1,40 V |
1,40 V |
1,40 V |
| Thermal Desing Power |
28-35 W |
30-39 W |
33-44 W |
| maximaler Strom |
45,8 Ampere |
45,8 Ampere |
45,8 Ampere |
| maximale Temperatur |
65°C |
65°C |
65°C |
|
|
|
|
| P-State 1 |
|
1800 MHz |
2000 MHz |
| Kernspannung |
|
1,35 V |
1,35 V |
| maximaler Strom |
|
39,3 A |
39,3 A |
| Thermal Desing Power |
|
56 W |
56 W |
|
|
|
|
| P-State 2 |
|
|
1800 MHz |
| Kernspannung |
|
|
1,30 V |
| maximaler Strom |
|
|
33,2 A |
| Thermal Desing Power |
|
|
46 W |
|
|
|
|
| P-State (Minimum) |
1000 MHz |
1000 MHz |
1000 MHz |
| Kernspannung |
1,10 V |
1,10 V |
1,10 V |
| maximaler Strom |
16,5 A |
16,5 A |
15,5 A |
| Thermal Desing Power |
21 W |
21 W |
20 W |
|
|
|
|
| Prozessorkern |
Winchester |
Winchester |
Winchester |
| Stepping |
D0 |
D0 |
D0 |
| Kerngröße |
84 mm² |
84 mm² |
84 mm² |
|
|
|
|
| Typ |
Desktop |
Desktop |
Desktop |
| Gehäuse |
organisches PGA |
organisches PGA |
organisches PGA |
| Pins |
939 |
939 |
939 |
| Fertigungsprozess |
90 nm |
90 nm |
90 nm |
|
|
|
|
| Speicheranbindung |
2*64 Bit (8 Bit ECC) |
2*64 Bit (8 Bit ECC) |
2*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
|
|
|
|
| I/O |
16 Bit HT, Full duplex |
16 Bit HT, Full duplex |
16 Bit HT, Full duplex |
| HyperTransport |
1000 MHz - 8,0 GiB/s |
1000 MHz - 8,0 GiB/s |
1000 MHz - 8,0 GiB/s |
| Modellnummer |
3500+ |
3800+ |
4000+ |
|
|
|
|
| OPN |
ADA3500DEP4AW |
ADA3800DEP4AW |
ADA4000DEP4AS |
| Taktfrequenz (P-Max) |
2200 MHz |
2400 MHz |
2400 MHz |
| L2 Cache |
512 KiB |
512 KiB |
1024 KiB |
| CPUID |
00000FF0h |
00000FF0h |
00000F7Ah |
|
|
|
|
| Kernspannung |
1,50 V |
1,50 V |
1,50 V |
| Thermal Desing Power |
64-89 W |
68-89 W |
68-89 W |
| maximaler Strom |
57,4 Ampere |
57,4 Ampere |
57,4 Ampere |
| maximale Temperatur |
70°C |
70°C |
70°C |
|
|
|
|
| P-State 1 |
2000 MHz |
2200 MHz |
2200 MHz |
| Kernspannung |
1,40 V |
1,40 V |
1,40 V |
| maximaler Strom |
47,2 A |
49,4 A |
49,4 A |
| Thermal Desing Power |
69 W |
72 W |
72 W |
|
|
|
|
| P-State 2 |
1800 MHz |
2000 MHz |
2000 MHz |
| Kernspannung |
1,30 V |
1,30 V |
1,30 V |
| maximaler Strom |
36,2 A |
38,5 A |
38,5 A |
| Thermal Desing Power |
50 W |
53 W |
53 W |
|
|
|
|
| P-State 3 |
|
1800 MHz |
1800 MHz |
| Kernspannung |
|
1,20 V |
1,20 V |
| maximaler Strom |
|
30,1 A |
30,1 A |
| Thermal Desing Power |
|
39 W |
39 W |
|
|
|
|
| P-State (Minimum) |
1000 MHz |
1000 MHz |
1000 MHz |
| Kernspannung |
1,10 V |
1,10 V |
1,10 V |
| maximaler Strom |
17,4 A |
17,4 A |
17,4 A |
| Thermal Desing Power |
22 W |
22 W |
22 W |
|
|
|
|
| Prozessorkern |
Newcastle |
Newcastle |
Clawhammer |
| Stepping |
CG |
CG |
CG |
| Kerngröße |
144 mm² |
144 mm² |
193 mm² |
|
|
|
|
| Typ |
Desktop |
Desktop |
Desktop |
| Gehäuse |
organisches PGA |
organisches PGA |
organisches PGA |
| Pins |
939 |
939 |
939 |
|
|
|
|
| Speicheranbindung |
2*64 Bit (8 Bit ECC) |
2*64 Bit (8 Bit ECC) |
2*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
|
|
|
|
| I/O |
16 Bit HT, Full duplex |
16 Bit HT, Full duplex |
16 Bit HT, Full duplex |
| HyperTransport |
1000 MHz - 8,0 GiB/s |
1000 MHz - 8,0 GiB/s |
1000 MHz - 8,0 GiB/s |
| Modellnummer |
3700+ |
|
|
| OPN |
ADA3700AEP5AR |
| Taktfrequenz (P-Max) |
2400 MHz |
| L2 Cache |
1024 KiB |
| CPUID |
00000F4Ah |
|
|
| Kernspannung |
1,50 V |
| Thermal Desing Power |
60-89 W |
| maximaler Strom |
57,8 Ampere |
| maximale Temperatur |
70°C |
|
|
| P-State 1 |
2200 MHz |
| Kernspannung |
1,40 V |
| maximaler Strom |
50,0 A |
| Thermal Desing Power |
72 W |
|
|
| P-State 2 |
2000 MHz |
| Kernspannung |
1,30 V |
| maximaler Strom |
39,0 A |
| Thermal Desing Power |
53 W |
|
|
| P-State 3 |
1800 MHz |
| Kernspannung |
1,20 V |
| maximaler Strom |
31,0 A |
| Thermal Desing Power |
39 W |
|
|
| P-State (Minimum) |
1000 MHz |
| Kernspannung |
1,10 V |
| maximaler Strom |
18,0 A |
| Thermal Desing Power |
22 W |
|
|
| Prozessorkern |
Clawhammer |
| Stepping |
CG |
| Kerngröße |
193 mm² |
|
|
| Typ |
Desktop |
| Gehäuse |
organisches PGA |
| Pins |
754 |
|
|
| Speicheranbindung |
1*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
|
|
| I/O |
16 Bit HT, Full duplex
|
| HyperTransport |
800 MHz - 6,4 GiB/s |
|