Mobiler Athlon 64
| Entwicklungsgeneration |
K8 |
|
|
| Kernproduktion |
FAB 30, Dresden, Deutschland |
| Test, Montage, Beschriftung |
Penang, Malaysia |
|
|
| Transistoren |
105,9 Millionen (Sledge-/Clawhammer) |
| Fertigungstechnik |
9 Lagen, CMOS (Complementary Metal-Oxide
Semiconductor), SOI (Silicon On Insulator), 6 Layer low-K Dielektrika,
Copper Interconnects |
|
|
|
|
| Level 1 Daten Cache |
64 KiB |
|
2-Way Associative |
|
8-Way Bank-Interleave |
|
2*64 Bit Zugriffe pro Takt, lesen oder
schreiben in verschiedenen Banken |
|
3 Takte Latenz |
|
ECC Cache Protection (8 KiB) |
|
40 TLB (Translation Look aside Buffers)
Einträge (32* 4k page translations, 8* 2/4 M page translations) |
|
|
| Level 1 Befehls Cache |
64 KiB |
|
2-Way Associative |
|
128 Bit Lese- und Schreib-Port |
|
Parity Protection (1 Bit pro 16 Bit) |
|
40 ITLB (Instruction Translation Look aside
Buffers) Einträge (32* 4k page translations, 8* 2/4 M page translations) |
|
|
| Level 2 Cache |
256/512/1024 KiB |
|
16-Way Associative |
|
Exclusive Architektur |
|
16 Takte Latenz (+ 3 Takte L1) |
|
ECC Cache Protection |
|
128 Bit Anbindung |
|
512 DTLB (Data Translation Look aside Buffers,
4-Way set-asociative virtual to physical address translation) |
|
512 ITLB (Instruction Translation Look aside
Buffers, 4-Way set-asociative virtual to physical address translation) |
|
|
|
|
| Integer Core |
12 stufige Pipeline |
|
3 ALU (Arithmetic Logic Unit) |
|
3 AGU (Address Generator Unit) |
|
64 Bit Integer Register |
|
48 Bit virtueller Adressraum, 40 Bit
physikalischer Adressraum |
|
16 General Purpose Register |
|
|
| Floating Point Core |
17 stufige Pipeline |
|
1*FMUL |
|
1*FADD |
|
1*FSTORE |
|
80 Bit Floating Point Register |
|
|
| Flags |
fpu vme de pse tsc msr pae mce cx8 apic sep
mtrr pge mca cmov pat nx pse36 clflush mmx fxsr sse sse2 syscall mmxext
lm 3dnowext 3dnow |
Mobiler Athlon 64
| Modellnummer |
3700+ |
|
|
| OPN |
AMA3700BEX5AR |
| Taktfrequenz (P-Max) |
2400 MHz |
| L2 Cache |
1024 KiB |
| CPUID |
00000F48h |
|
|
| Kernspannung |
1,50 V |
| Thermal Desing Power |
60-81,5 W |
| maximaler Strom |
52,9 Ampere |
| maximale Temperatur |
95°C |
|
|
| P-State 1 |
2200 MHz |
| Kernspannung |
1,40 V |
| maximaler Strom |
50,0 A |
| Thermal Desing Power |
72 W |
|
|
| P-State 2 |
2000 MHz |
| Kernspannung |
1,30 V |
| maximaler Strom |
39,0 A |
| Thermal Desing Power |
53 W |
|
|
| P-State 3 |
1800 MHz |
| Kernspannung |
1,20 V |
| maximaler Strom |
31,0 A |
| Thermal Desing Power |
39 W |
|
|
| P-State (Minimum) |
1000 MHz |
| Kernspannung |
1,10 V |
| maximaler Strom |
18,0 A |
| Thermal Desing Power |
22 W |
|
|
| Prozessorkern |
Clawhammer |
| Stepping |
CG |
| Kerngröße |
193 mm² |
|
|
| Typ |
Desktop Ersatz |
| Gehäuse |
organisches PGA |
| Pins |
754 |
|
|
| Speicheranbindung |
1*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
|
|
| I/O |
16 Bit HT, Full duplex |
| HyperTransport |
800 MHz - 6,4 GiB/s |
| Modellnummer |
3000+ |
3200+ |
3400+ |
|
|
|
|
| OPN |
AMA3000BEX5AP |
AMA3200BEX5AP |
AMA3400BEX5AP |
| Taktfrequenz (P-Max) |
1800 MHz |
2000 MHz |
2200 MHz |
| L2 Cache |
1024 KiB |
1024 KiB |
1024 KiB |
| CPUID |
00000F48h |
00000F48h |
00000F48h |
|
|
|
|
| Kernspannung |
1,50 V |
1,50 V |
1,50 V |
| Thermal Desing Power |
60-81,5 W |
60-81,5 W |
60-81,5 W |
| maximaler Strom |
52,9 Ampere |
52,9 Ampere |
52,9 Ampere |
| maximale Temperatur |
95°C |
95°C |
95°C |
|
|
|
|
| P-State 1 |
1600 MHz |
1800 MHz |
2000 MHz |
| Kernspannung |
1,40 V |
1,40 V |
1,40 V |
| maximaler Strom |
39,1 A |
42 A |
44,9 A |
| Thermal Desing Power |
57 W |
61 W |
65 W |
|
|
|
|
| P-State 2 |
|
1600 MHz |
1800 MHz |
| Kernspannung |
|
1,30 V |
1,30 V |
| maximaler Strom |
|
32,0 A |
35,2 A |
| Thermal Desing Power |
|
44 W |
48 W |
|
|
|
|
|
|
|
|
| P-State (Minimum) |
800 MHz |
800 MHz |
800 MHz |
| Kernspannung |
1,10 V |
1,10 V |
1,10 V |
| maximaler Strom |
15,3 A |
15,3 A |
15,3 A |
| Thermal Desing Power |
19 W |
19 W |
19 W |
|
|
|
|
| Prozessorkern |
Clawhammer |
Clawhammer |
Clawhammer |
| Stepping |
C0 |
C0 |
C0 |
| Kerngröße |
193mm² |
193mm² |
193mm² |
|
|
|
|
| Typ |
Desktop Ersatz |
Desktop Ersatz |
Desktop Ersatz |
| Gehäuse |
organisches PGA |
organisches PGA |
organisches PGA |
| Pins |
754 |
754 |
754 |
|
|
|
|
| Speicheranbindung |
1*64 Bit (8 Bit ECC) |
1*64 Bit (8 Bit ECC) |
1*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
|
|
|
|
| I/O |
16 Bit HT, Full duplex
|
16 Bit HT, Full duplex
|
16 Bit HT, Full duplex
|
| HyperTransport |
800 MHz - 6,4 GiB/s |
800 MHz - 6,4 GiB/s |
800 MHz - 6,4 GiB/s |
| Modellnummer |
3000+ |
3200+ |
3400+ |
|
|
|
|
| OPN |
AMA3000BEX5AR |
AMA3200BEX5AR |
AMA3400BEX5AR |
| Taktfrequenz (P-Max) |
1800 MHz |
2000 MHz |
2200 MHz |
| L2 Cache |
1024 KiB |
1024 KiB |
1024 KiB |
| CPUID |
00000F4Ah |
00000F4Ah |
00000F4Ah |
|
|
|
|
| Kernspannung |
1,50 V |
1,50 V |
1,50 V |
| Thermal Desing Power |
60-81,5 W |
60-81,5 W |
60-81,5 W |
| maximaler Strom |
52,9 Ampere |
52,9 Ampere |
52,9 Ampere |
| maximale Temperatur |
95°C |
95°C |
95°C |
|
|
|
|
| P-State 1 |
1600 MHz |
1800 MHz |
2000 MHz |
| Kernspannung |
1,40 V |
1,40 V |
1,40 V |
| maximaler Strom |
39,1 A |
41,3 A |
44,1 A |
| Thermal Desing Power |
57 W |
60 W |
64 W |
|
|
|
|
| P-State 2 |
|
1600 MHz |
1800 MHz |
| Kernspannung |
|
1,30 V |
1,30 V |
| maximaler Strom |
|
32,2 A |
34,5 A |
| Thermal Desing Power |
|
44 W |
47 W |
|
|
|
|
|
|
|
|
| P-State (Minimum) |
800 MHz |
800 MHz |
800 MHz |
| Kernspannung |
1,10 V |
1,10 V |
1,10 V |
| maximaler Strom |
15,3 A |
15,3 A |
15,3 A |
| Thermal Desing Power |
19 W |
19 W |
19 W |
|
|
|
|
| Prozessorkern |
Clawhammer |
Clawhammer |
Clawhammer |
| Stepping |
CG |
CG |
CG |
| Kerngröße |
193mm² |
193mm² |
193mm² |
|
|
|
|
| Typ |
Desktop Ersatz |
Desktop Ersatz |
Desktop Ersatz |
| Gehäuse |
organisches PGA |
organisches PGA |
organisches PGA |
| Pins |
754 |
754 |
754 |
|
|
|
|
| Speicheranbindung |
1*64 Bit (8 Bit ECC) |
1*64 Bit (8 Bit ECC) |
1*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
|
|
|
|
| I/O |
16 Bit HT, Full duplex
|
16 Bit HT, Full duplex
|
16 Bit HT, Full duplex
|
| HyperTransport |
800 MHz - 6,4 GiB/s |
800 MHz - 6,4 GiB/s |
800 MHz - 6,4 GiB/s |
| Modellnummer |
2800+ |
3000+ |
3200+ |
|
|
|
|
| OPN |
AMN2800BIX5AP |
AMN3000BIX5AP |
AMN3200BIX5AP |
| Taktfrequenz (P-Max) |
1600 MHz |
1800 MHz |
2000 MHz |
| L2 Cache |
1024 KiB |
1024 KiB |
1024 KiB |
| CPUID |
00000F48h |
00000F48h |
00000F48h |
|
|
|
|
| Kernspannung |
1,40 V |
1,40 V |
1,40 V |
| Thermal Desing Power |
50 - 62 W |
54 - 62 W |
62 W |
| maximaler Strom |
42,7 A |
42,7 A |
42,7 A |
| maximale Temperatur |
95°C |
95°C |
95°C |
|
|
|
|
| P-State 1 |
|
1600 MHz |
1800 MHz |
| Kernspannung |
|
1,30 V |
1,30 V |
| maximaler Strom |
|
31,4 A |
33,7 A |
| Thermal Desing Power |
|
43 W |
46 W |
|
|
|
|
| P-State 2 |
|
|
1600 MHz |
| Kernspannung |
|
|
1,20 V |
| maximaler Strom |
|
|
26,5 A |
| Thermal Desing Power |
|
|
34 W |
|
|
|
|
|
|
|
|
| P-State (Minimum) |
800 MHz |
800 MHz |
800 MHz |
| Kernspannung |
0,95 V |
0,95 V |
0,95 V |
| maximaler Strom |
11,4 A |
11,4 A |
11,4 A |
| Thermal Desing Power |
13 W |
13 W |
13 W |
|
|
|
|
| Prozessorkern |
Clawhammer |
Clawhammer |
Clawhammer |
| Stepping |
C0 |
C0 |
C0 |
| Kerngröße |
193mm² |
193mm² |
193mm² |
|
|
|
|
| Typ |
Schlepptop |
Schlepptop |
Schlepptop |
| Gehäuse |
organisches PGA |
organisches PGA |
organisches PGA |
| Pins |
754 |
754 |
754 |
|
|
|
|
| Speicheranbindung |
1*64 Bit (8 Bit ECC) |
1*64 Bit (8 Bit ECC) |
1*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
PC1600, PC2100, PC2700, PC3200 |
|
|
|
|
| I/O |
16 Bit HT, Full duplex
|
16 Bit HT, Full duplex
|
16 Bit HT, Full duplex
|
| HyperTransport |
800 MHz - 6,4 GiB/s |
800 MHz - 6,4 GiB/s |
800 MHz - 6,4 GiB/s |
|