Athlon 64 FX

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Prozessorkern
Sledgehammer
Kern

diedie






Entwicklungsgeneration K8


Kernproduktion FAB 30, Dresden, Deutschland
Test, Montage, Beschriftung Penang, Malaysia


Kernphoto Clawhammer Kern


Transistoren 105,9 Millionen
Fertigungstechnik 9 Lagen, CMOS (Complementary Metal-Oxide
Semiconductor), SOI (Silicon On Insulator), 6 Layer low-K Dielektrika,
Copper Interconnects




Level 1 Daten Cache 64 KiB

2-Way Associative

8-Way Bank-Interleave

2*64 Bit Zugriffe pro Takt, lesen oder
schreiben in verschiedenen Banken

3 Takte Latenz

ECC Cache Protection (8 KiB)

40 TLB (Translation Look aside Buffers)
Einträge (32* 4k page translations, 8* 2/4 M page translations)


Level 1 Befehls Cache 64 KiB

2-Way Associative

128 Bit Lese- und Schreib-Port

Parity Protection (1 Bit pro 16 Bit)

40 ITLB (Instruction Translation Look aside
Buffers) Einträge (32* 4k page translations, 8* 2/4 M page translations)


Level 2 Cache 256/512/1024 KiB

16-Way Associative

Exclusive Architektur

16 Takte Latenz (+ 3 Takte L1)

ECC Cache Protection

128 Bit Anbindung

512 DTLB (Data Translation Look aside Buffers,
4-Way set-asociative virtual to physical address translation)

512 ITLB (Instruction Translation Look aside
Buffers, 4-Way set-asociative virtual to physical address translation)




Integer Core 12 stufige Pipeline

3 ALU (Arithmetic Logic Unit)

3 AGU (Address Generator Unit)

64 Bit Integer Register

48 Bit virtueller Adressraum, 40 Bit
physikalischer Adressraum

16 General Purpose Register


Floating Point Core 17 stufige Pipeline

1*FMUL

1*FADD

1*FSTORE



Modellnummer FX53 FX55



OPN ADAFX53DEP5AS ADAFX55DEI5AS
Taktfrequenz (P-Max) 2400 MHz 2600 MHz
L2 Cache 1024 KiB 1024 KiB
CPUID 00000F7Ah 00000F7Ah



Kernspannung 1,50 V 1,50 V
Thermal Desing Power 68-89 W 80-104 W
maximaler Strom 57,4 Ampere 67,4 Ampere
maximale Temperatur 70°C 63°C



P-State 1

Kernspannung

maximaler Strom

Thermal Desing Power




P-State 2

Kernspannung

maximaler Strom

Thermal Desing Power




P-State 3

Kernspannung

maximaler Strom

Thermal Desing Power




P-State (Minimum) 1200 MHz 1200 MHz
Kernspannung 1,10 V 1,10 V
maximaler Strom 20,1 A 20,1 A
Thermal Desing Power 25 W 25 W



Prozessorkern Sledgehammer Sledgehammer
Stepping CG CG
Kerngröße 193 mm² 193 mm²



Typ Desktop Desktop
Gehäuse organisches PGA organisches PGA
Pins 939 939



Speicheranbindung 2*64 Bit (8 Bit ECC) 2*64 Bit (8 Bit ECC)
Unterstützter Speicher PC1600, PC2100, PC2700, PC3200 PC1600, PC2100, PC2700, PC3200



I/O 16 Bit HT, Full duplex 16 Bit HT, Full duplex
HyperTransport 1000 MHz - 8,0 GiB/s 1000 MHz - 8,0 GiB/s