Sempron
Logo
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Prozessor Kern
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Paris (130 nm)
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| Entwicklungsgeneration |
K8 |
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| Kernproduktion |
FAB 30, Dresden, Deutschland |
| Test, Montage, Beschriftung |
Penang, Malaysia |
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| Transistoren |
68|5 Millionen (Paris) |
| Fertigungstechnik |
9 Lagen, CMOS (Complementary Metal-Oxide
Semiconductor), SOI (Silicon On Insulator), 6 Layer low-K Dielektrika,
Copper Interconnects |
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| Level 1 Daten Cache |
64 KiB |
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2-Way Associative |
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8-Way Bank-Interleave |
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2*64 Bit Zugriffe pro Takt, lesen oder
schreiben in verschiedenen Banken |
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3 Takte Latenz |
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ECC Cache Protection (8 KiB) |
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40 TLB (Translation Look aside Buffers)
Einträge (32* 4k page translations, 8* 2/4 M page translations) |
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| Level 1 Befehls Cache |
64 KiB |
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2-Way Associative |
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128 Bit Lese- und Schreib-Port |
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Parity Protection (1 Bit pro 16 Bit) |
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40 ITLB (Instruction Translation Look aside
Buffers) Einträge (32* 4k page translations, 8* 2/4 M page translations) |
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| Level 2 Cache |
256/512 KiB |
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16-Way Associative |
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Exclusive Architektur |
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16 Takte Latenz (+ 3 Takte L1) |
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ECC Cache Protection |
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128 Bit Anbindung |
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512 DTLB (Data Translation Look aside Buffers,
4-Way set-asociative virtual to physical address translation) |
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512 ITLB (Instruction Translation Look aside
Buffers, 4-Way set-asociative virtual to physical address translation) |
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| Integer Core |
12 stufige Pipeline |
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3 ALU (Arithmetic Logic Unit) |
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3 AGU (Address Generator Unit) |
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32 Bit virtueller Adressraum, 40 Bit
physikalischer Adressraum |
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8 General Purpose Register |
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| Floating Point Core |
17 stufige Pipeline |
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1*FMUL |
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1*FADD |
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1*FSTORE |
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80 Bit Floating Point Register |
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| Flags |
fpu vme de pse tsc msr pae mce cx8 apic sep
mtrr pge mca cmov pat nx pse36 clflush mmx fxsr sse sse2 syscall mmxext
lm 3dnowext 3dnow |
Sempron
(Die "Thermal Desing Power" Angaben beim P-Max Modus basieren teilweise auf Messwerte verschiedener Quellen, alle anderen Zahlen sind die theoretischen Maxima)
| Modellnummer |
3100+ |
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| OPN |
SDA3100AIP3AX |
| Taktfrequenz (P-Max) |
1800 MHz |
| L2 Cache |
256 KiB |
| CPUID |
00000FC0h |
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| Kernspannung |
1,40 V |
| Thermal Desing Power |
45-55 W (62 W) |
| maximaler Strom |
42,7 Ampere |
| maximale Temperatur |
70°C |
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| P-State 1 |
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| Kernspannung |
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| maximaler Strom |
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| Thermal Desing Power |
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| P-State 2 |
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| Kernspannung |
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| maximaler Strom |
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| Thermal Desing Power |
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| P-State (Minimum) |
1000 MHz |
| Kernspannung |
1,10 V |
| maximaler Strom |
16,2 A |
| Thermal Desing Power |
20 W |
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| Prozessorkern |
Paris |
| Stepping |
CG |
| Kerngröße |
144 mm² |
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| Typ |
Desktop |
| Gehäuse |
organisches PGA |
| Pins |
754 |
| Fertigungsprozess |
130 nm |
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| Speicheranbindung |
1*64 Bit (8 Bit ECC) |
| Unterstützter Speicher |
PC1600, PC2100, PC2700, PC3200 |
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| I/O |
16 Bit HT, Full duplex |
| HyperTransport |
800 MHz - 6,4 GiB/s |
Quellenverzeichnis
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